Nonconventional / Special Materials
Aluminum Alloy Packages
SHORT DESCRIPTION:
The advantages of aluminum alloy are its light weight, robust strength, and the ease with which it can be molded. As such it is widely used in the manufacturing of electronic packaging.
MAIN FEATURES:
High thermal conductivity
•Low density
•Good platability and workability, wire cutting, grinding and surface gold plating can be performed.
| MODEL | COEFFICIENT OF THERMAL EXPANSION/×10-6 /K | THERMAL CONDUCTIVITY/W.(m.K)-1 | THE DENSITY OF/g.cm-3 |
| A1 6061 | 22.6 | 210 | 2.7 |
| A1 4047 | 21.6 | 193 | 2.6 |
Aluminum Silicon Metal Packages
SHORT DESCRIPTION:
Si/Al alloys for electronic packages mainly refer to eutectic alloy materials with a silicon content of 11% to 70%. Its density is low, the coefficient of thermal expansion can be matched to the chip and substrate, and its ability to dissipate heat is excellent. Its machining performance is also ideal. As a result, Si/Al alloys have enormous potential in the electronic packaging industry.
MAIN FEATURES:
•Fast heat dissipation and high thermal conductivity can solve the heat dissipation problems inherent in the development of high-power devices.
•The coefficient of thermal expansion is controllable, which makes it possible to match that of the chip, avoiding excessive thermal stress that can cause device failure.
•Low density
| CE Alloy designation | CE20 | CE17 | CE17M | CE13 | CE11 | CE9 | CE7 |
| Alloy composition | Al-12%Si | Al-27%Si | Al-27%Si* | Al-42%Si | Si-50%Al | Si-40%Al | Si-30%Al |
| CTE，ppm/℃，25-100℃ | 20 | 16 | 16 | 12.8 | 11 | 9 | 7.4 |
| Density,g/cm3 | 2.7 | 2.6 | 2.6 | 2.55 | 2.5 | 2.45 | 2.4 |
| Thermal Conductivity at 25℃ W/mK | 177 | 147 | 160 | 149 | 129 | 120 | |
| Bend Strength，MPa | 210 | 213 | 172 | 140 | 143 | ||
| Yield Strength，MPa | 183 | 155 | 125 | 134 | 100 | ||
| Elastic Modulus，GPa | 92 | 92 | 107 | 121 | 124 | 129 |
Diamond/Copper, Diamond/Aluminum
SHORT DESCRIPTION:
Diamond/Copper and Diamond/Aluminum are composite materials with diamond as the reinforcing phase and copper or aluminum as the matrix material. These are very competitive and promising electronic packaging materials. For both diamond/copper and diamond/aluminum metal housing, the thermal conductivity of the chip area is ≥500W/( m•K) -1, satisfying the performance requirements of high heat dissipation of the circuit. With the continuous expansion of research, these types of housing will play an increasingly important role in the field of electronic packaging.
MAIN FEATURES:
•High thermal conductivity
•The coefficient of thermal expansion (CTE) can be controlled by changing the mass fraction of the diamond and Cu materials
•Low density
•Good platability and workability, wire cutting, grinding and surface gold plating can be carried out
| MODEL | DIAMOND60%-COPPER40% | DIAMOND40%-COPPER60% | DIAMOND ALUMINUM |
| COEFFICIENT OF THERMAL EXPANSION/×10-4/K | 4 | 6 | 7 |
| THERMAL CONDUCTIVITY/W.(m.K)-1 | 600 | 550 | >450 |
| THE DENSITY OF/g.cm-3 | 4.6 | 5.1 | 3.2 |
AlN substrate
SHORT DESCRIPTION:
Aluminum nitride ceramic is a technical ceramic material. It has excellent thermal, mechanical and electrical properties, such as high electrical conductivity, a small relative dielectric constant, a linear expansion coefficient matching silicon, excellent electrical insulation, and low density. It is non-toxic and strong. With the widespread development of microelectronic devices, aluminum nitride ceramics as a base material or for the package’s housing, has become increasingly popular. It is a promising high-power integrated circuit substrate and packaging material.
MAIN FEATURES:
•High thermal conductivity (about 270W/m•K), close to BeO and SiC, and more than 5 times that of Al2O3
•The thermal expansion coefficient matches Si and GaAs
•Excellent electrical properties (relatively small dielectric constant, dielectric loss, volume resistivity, dielectric strength)
•High mechanical strength and ideal machining performance
•Ideal optical and microwave characteristics
•Non-toxic
QUALITY CONTROL
Over the years we have finely tuned our multi-step process of ensuring every single component passes all quality and functionality tests, tests that begin even before raw materials are on-boarded. At this first stage, each shipment of raw materials undergoes an acceptance sampling method assortment which makes a determination about whether to accept the material. If such a determination is made, the entire shipment is cleaned, a full inspection is performed, minor imperfections are buffed and polished, and stock is then warehoused. The second stage is conducted immediately following the initial assembly and brazing stages. Every single product undergoes an individual visual inspection followed by a preliminary hermeticity test. For hermeticity we utilize a helium leak test that is adjusted to meet the exacting air tightness requirements of our clients. Following the plating stage, each batch undergoes a sampling inspection and a coating bonding degree analysis. Products that make it past this stage are then subjected to full inspection which includes scrutiny of appearance, construction, plating thickness, and a second helium tracer gas hermeticity test. Finally products are put through the full range of Factory Inspection trials. These include pin fatigue tests, a salt spray corrosion resistance test and analysis that relies on climate simulation equipment to test product performance. Once products are approved, they are individually vacuum-packed with a deoxidizing desiccant insert and ensconced in additional protective packaging before being shipped out. These efforts guarantee that every Jitai product delivered to you is of the same high quality as when it left the factory.
